The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2003

Filed:

Nov. 05, 2001
Applicant:
Inventor:

Frederick J. Buja, Rochester, NY (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 4/578 ;
U.S. Cl.
CPC ...
B29C 4/578 ;
Abstract

The present invention is a method and apparatus for controlling a mold flow process using inner (impinge) and/or edge temperature sensors, wherein articles processed in a constraining mold cavity, having a constant melt “shrink” quality, can be obtained even with fluctuations in resin “melt” properties (flowability). At least one temperature-dependent output or “trigger” signal is sampled, and the level of the signal (e.g., temperature) initiates at least one step in the molding cycle. Using a sampling circuit, thermal waveforms are obtained from thermal sensor array data such that if a sequence of melt temperature set-point trigger times fluctuates outside control limits, then the process melt-flow is judged as a hotter/faster melt-flow or cooler/slower melt-flow injection process.


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