The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2003
Filed:
Dec. 08, 2000
Applicant:
Inventors:
Tobita Masayuki, Tokyo, JP;
Shinya Tateda, Tokyo, JP;
Tsunehisa Kimura, Tokyo, JP;
Masahumi Yamato, Tokyo, JP;
Assignee:
Polymatech Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/100 ;
U.S. Cl.
CPC ...
B32B 3/100 ;
Abstract
The present invention provides an adhesion method of improving the heat conduction in a fixed direction by using a heat conductive adhesive made by blending boron nitride powder and adhesive polymer and adhering by orienting boron nitride powder in the heat conductive adhesive to the fixed direction under the magnetic atmosphere and an electronic component for effectively dissipating heat generated from semiconductor device , power source , light source or other components used for the electric products, and an electronic component excellent in radiation.