The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2003
Filed:
Dec. 13, 2001
Applicant:
Inventors:
Wei Te Wang, Taipei, TW;
Hung-Bin Chan, Taipei, TW;
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 1/526 ;
U.S. Cl.
CPC ...
B23P 1/526 ;
Abstract
A method for fabricating a heat pipe structure in a radiating plate is provided. A tunneling means is used to form a plurality of radiating channels in the radiating plate. Each of the plurality of radiating channels has only one opening. Then, only one of the openings of the radiating channels is left unsealed, while sealing the other openings of the radiating channels. Working fluid is injected into the radiating channels via the unsealed opening. The radiating channels are vacuated and the unsealed opening is sealed.
Wang, Wei. (2003). Method for fabricating a heat pipe structure in a radiating plate (U.S. Patent No. 6647625). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6647625
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile