The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2003
Filed:
Mar. 15, 2001
Applicant:
Inventors:
Assignee:
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 2/728 ; C09J / ; C08L 7/908 ; C08L 6/300 ;
U.S. Cl.
CPC ...
B32B 2/728 ; C09J / ; C08L 7/908 ; C08L 6/300 ;
Abstract
A film-type adhesive for electronic components comprises a polyimide resin made up of specific repeating units and having a weight-average molecular weight of 5,000-150,000 in combination with an epoxy resin bearing at least two glycidyl groups per molecule. The adhesive has a weight ratio of the polyimide resin to the epoxy resin within a range of 50/50 to 5/95, and a film thickness of 20-150 &mgr;m. Such a film-type adhesive makes it possible to simplify and shorten the duration of assembly operations for electronic components having various types of adherend surfaces.