The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2003
Filed:
May. 30, 2001
Eiichi Okazaki, Aichi, JP;
Tetsuji Jitsumatsu, Aichi, JP;
Toagosei Co., Ltd., Tokyo, JP;
Abstract
A pressure-sensitive adhesive composition curable with actinic energy rays which comprises a copolymer comprising 0.1 to 30 wt. %, preferably 0.1 to 3 wt. %, structural units derived from an imide (meth)acrylate represented by general formula (1) and 70 to 99.9 wt. %, preferably 97 to 99.9 wt. %, structural units derived from an ethylenic monomer such as an alkyl (meth)acrylate having a C alkyl group. In formula (1), R and R each independently is hydrogen or C alkyl, one of R and R is hydrogen and the other is C alkyl, or R and R are bonded to each other to form a carbon ring; R is C alkylene; R is hydrogen or methyl; and n is an integer of 1 to 6. The pressure-sensitive adhesive composition is usable as one-pack type, has excellent storage stability, and does not necessitate any step such as heating or aging when used. The cured article obtained therefrom is excellent in bonding strength and holding power, is substantially odorless, and is extremely suitable for use in pressure-sensitive adhesive sheets, etc.