The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2003
Filed:
Apr. 12, 2002
Applicant:
Inventors:
Tetsuo Nakano, Toyoake, JP;
Yukihiro Maeda, Kasugai, JP;
Yasutomi Asai, Okazaki, JP;
Takashi Nagasaka, Anjo, JP;
Assignee:
Denso Corporation, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 1/500 ; H01L 2/348 ;
U.S. Cl.
CPC ...
B32B 1/500 ; H01L 2/348 ;
Abstract
A substrate has a first surface and a second surface. A plurality of pads is formed on the first surfaces. Each pads has a Cu plating layer and an Au plating layer that is directly formed on the Cu plating layer. Al wiring or Au wiring is bonded with the pads. The thickness of the Au plating layer that is bonded with the Al wiring is less than 0.5 &mgr;m. Thickness of the Au plating layer that is bonded with the Au wiring is 0.05 &mgr;m or more.