The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2003
Filed:
Aug. 21, 2001
Ayumi Suzuki, Ogaki, JP;
Ayao Niki, Ogaki, JP;
Ryo Aoki, Ogaki, JP;
Kazuhisa Kitajima, Ogaki, JP;
Susumu Kagohashi, Ogaki, JP;
Yukari Kajiyama, Kariya, JP;
Hiroshi Tanaka, Kariya, JP;
Other;
Abstract
A roll coater with which an interlaminar resin insulating layer and/or a solder resist layer can be formed with good thickness uniformity to enable the manufacture of a printed circuit board free from the no-hole defect and anomalies in the diameter and geometry of the holes for via-hole and/or solder bump which is due to uneven layer thickness, thus having high electrical integrity and reliability. This roll coater is used for forming an interlaminar resin insulating layer and/or a solder resist layer in the manufacture of a printed circuit board including a substrate and, as serially built up thereon, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition, with a solder resist layer formed on top of the resulting multilayer structure, which comprises rolls each having a surface formed with a multiplicity of grooves running in the direction of roll rotation, with the grooves in the roll-end or marginal areas of the surface being relatively reduced in depth as compared with the remaining area.