Method and apparatus for the transport and tracking of an electronic component

Abstract

An apparatus for use in manipulating one or more IC die through testing after they have been cut from the original wafer. A carrier supports the die during the transport, testing, and/or final application. The die is placed into the carrier through an opening and then resides on a ledge lining some portion of the base of the opening. The spring components of the die extend downward through the opening and past the lower side of the ledge to allow for electrical contact. The die may be secured within the carrier opening in a variety of ways, including a cover coupled to the top of the carrier or through use of snap locks in the carrier. One useful cover has openings revealing a portion of the backside of the die. The cover openings allow access to the backside of the die. The carrier can be mounted onto a test bed for testing or a printed circuit board for a specific application. Alternatively, the carrier may first be positioned on the board with the die and the cover subsequently mounted thereon. Carrier standoffs for protection of leads and identification labels and marks for carrier and die may be used.