The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2003
Filed:
May. 11, 2001
Masami Kudo, Kanagawa, JP;
Toshio Kazama, Nagano, JP;
Yoshio Yamada, Nagano, JP;
Kazushi Watanabe, Tokyo, JP;
NHK Spring Co., Ltd, Kanagawa, JP;
Abstract
The holder for an electroconductive contact unit according to the present invention uses a silicon wafer having a laminated structure including a first silicon layer, second silicon layer and silicon oxide film which is disposed between the two silicon layers. A small hole is formed in the first silicon layer for coaxially and slidably guiding a head portion of an electroconductive needle member, and a large hole is formed in the second silicon layer for receiving a flange portion of the needle member and a compression coil spring so that the silicon oxide film serves as a stopper for the flange member. Thus, by finishing the surface of the first silicon layer by lapping, the projecting length of the electroconductive needle member can be defined at a high precision. When the object to be tested consists of a silicon wafer, because the holder is made of the same material as the object to be tested, and they undergo a substantial identical thermal expansion, there is no positional shifting of each electroconductive needle member in simultaneously accessing a plurality of points.