The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2003

Filed:

Dec. 30, 2002
Applicant:
Inventors:

Takaaki Shirasawa, Tokyo, JP;

Yasuo Koutake, Fukuoka, JP;

Tsuyoshi Takayama, Fukuoka, JP;

Natsuki Tsuji, Hiroshima, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/976 ;
U.S. Cl.
CPC ...
H01L 2/976 ;
Abstract

An IGBT ( ) and a diode ( ) are joined onto an element arrangement portion ( ) of a first terminal member ( ) and an element arrangement portion ( ) of a second terminal member ( ) is joined onto the IGBT ( ) and the diode ( ). Further, an IGBT ( ) and a diode ( ) are joined onto the element arrangement portion ( ) of the second terminal member ( ) and an element arrangement portion ( ) of a third terminal member ( ) is joined onto the IGBT ( ) and the diode ( ). A transfer mold package ( ) is so formed as to house the elements ( ). External connection portions ( ) of the terminal members ( ) are drawn out of the package ( ). The element arrangement portion(s) ( ) of the first and/or third terminal member ( ) are/is exposed out of the package ( ).


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