The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6642312 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 04, 2003

Filed:

Dec. 26, 2001
Applicant:
Inventors:

Bong-Hyun Park, Kyoungki-do, KR;

Sung-Jun Lee, Kyoungki-do, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 2/300 ; C08L 2/304 ; C08K 3/26 ; C08K 3/34 ;
U.S. Cl.
CPC ...
C08L 2/300 ; C08L 2/304 ; C08K 3/26 ; C08K 3/34 ;
Abstract

The present invention relates to a polyolefin-based composite resin composition having excellent dimensional stability due to low mold shrinkage, low linear thermal expansion coefficient and low heat sag as well as having excellent mechanical strength, impact resistance, heat resistance, injection molding plasticity and surface smoothness of a product. The composition includes: 30-80% by weight of a crystalline ethylene-propylene copolymer; 5-40% by weight of an ethylene-&agr;-olefin copolymer; 5-40% by weight of an inorganic fortifier; and additives.


Find Patent Forward Citations

Park, Bong-Hyun. (2003). Polyolefin-based composite resin composition having high strength and low linear expansion (U.S. Patent No. 6642312). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6642312

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…