The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2003
Filed:
Apr. 23, 2002
Martin P. Goetz, Dallas, TX (US);
Merrill A. Hatcher, Garland, TX (US);
Christopher E. Jones, Arlington, TX (US);
Clarisay, Inc., Dallas, TX (US);
Abstract
A hermetic package for an electronic device, such as a surface acoustic wave (SAW) device and a method of manufacturing the same. In one embodiment, the package includes: (1) a device substrate having: (a) an active region containing an electrically conductive pattern that constitutes at least a portion of the device, (b) a contact region surrounding the active region and containing bond pads that are electrically coupled to the pattern and (c) a bonding region surrounding the active region, (2) a non-porous mounting substrate having a bonding region thereon and a footprint smaller than a footprint of the device substrate and (3) a bonding agent, located between the bonding region of the device substrate and the bonding region of the mounting substrate, that bonds the device substrate to the mounting substrate to enclose the active region proximate a void between the device substrate and the mounting substrate, the contact region remaining exposed.