The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2003

Filed:

Jul. 31, 2001
Applicant:
Inventors:

Michael Baecker, Cologne, DE;

Joachim Bock, Erftstadt, DE;

Herbert C. Freyhardt, Goettingen, DE;

Andreas Leenders, Goettingen, DE;

Heribert Walter, Goettingen, DE;

Martin Ullrich, Langgoens, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D 1/00 ; B05D 3/02 ; B05D 7/22 ;
U.S. Cl.
CPC ...
B05D 1/00 ; B05D 3/02 ; B05D 7/22 ;
Abstract

A method of curing cracks in a ceramic shaped body made from ceramic magnet materials or ceramic superconductor materials, in which a filling material which melts at a lower temperature than the material of the shaped body or is flowable at a lower temperature than the material of the shaped body is applied to the surface of the shaped body at least in the area of a crack and/or is introduced into at least one crack, in which the shaped body with the filling material is heated to and maintained at a temperature at which the material of the shaped body does not yet melt or is not yet flowable, but at which the filling material is in at least partially molten and flowable state at least until the fused filling material can penetrate at least partially into the crack, in which the filling material consists of non-metallic or essentially of non-metallic compounds and is at least partially crystallized, and in which the shaped body with the filling material is cooled, wherein the thermal crystallization conditions for the filling material are selected in such a way that the filling material grows epitaxially on the crack face.


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