The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2003
Filed:
Jul. 27, 2001
Randolph L. Davidson, Menasha, WI (US);
Robert John Blemberg, Appleton, WI (US);
Abstract
The present invention discloses an extrusion die module having a flat compression seal and a conical or otherwise angled spillover surface. The die module promotes a flat surface to flat surface compression seal outside of the flow distribution channels and promotes better streamlined flow and material combination than a traditional flat disk die module. The die module promotes a reduced overall diameter and wetted diameter in comparison to standard flat disk dies. Further, the present invention relates to a method for utilizing an extrusion die module with a conical or otherwise angled spillover surface to minimize the die surface area wetted by an intermediate layer in a multi-layer coextrusion process.