The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2003
Filed:
Dec. 12, 2001
Akira Miyoshi, Hyogo, JP;
Masahiro Ikeji, Hyogo, JP;
Nobuo Satou, Hyogo, JP;
Shigeru Sakaue, Hyogo, JP;
Tadashi Taniguchi, Hyogo, JP;
ShinMaywa Industries, Ltd., Nishinomiya, JP;
Abstract
A wire processing apparatus includes an applicator ( ) for crimping a crimp contact onto an end of a wire ( ) and solder depositing units ( ) for depositing solder onto an exposed core on the wire end, all of which serve as wire processing units. The applicator ( ) and the solder depositing units ( ) are attachable to and removable from a placement section ( ) and are interchangeable with each other. Each of the solder depositing units ( ) includes a flux bath ( ) for storing a flux liquid therein, a solder bath ( ) for storing solder in a molten state therein, and a flux liquid holding tube having a holding hole for holding the flux liquid therein and capable of releasably receiving the core. The core is moved downwardly into a solder portion raised by the surface tension of the solder stored in the solder bath whereby the solder is deposited on the core.