The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2003

Filed:

Jun. 01, 2000
Applicant:
Inventor:

Michael J. Renn, Hudson, WI (US);

Assignee:

Optomec Design Company, Albuquerque, NM (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/02 ;
U.S. Cl.
CPC ...
G02B 6/02 ;
Abstract

Methods and apparatus are disclosed for using a beam of energy, specifically laser light ( ), to transport, suspend or trap non-atomic size particles ( ) within a hollow-core optical fiber ( ), manipulating the particles ( ) along the fiber ( ) over distances and depositing them on a substrate ( ). A laser generates a beam ( ) focused on a fiber ( ) entrance ( ). A source ( ) delivers particles ( ) to the entrance ( ). Particles ( ) are drawn into the beam ( ) and propelled through the core ( ) of the fiber ( ). Forces (F -F ) on a particle ( ) generated by reflection, absorption and refraction of laser light ( ) keep the particle ( ) close to the fiber's center and propel it along the fiber's length. A variety of micron-size particles, including solids, solid dielectrics, semiconductors, liquids, aerosols and living cells are conveyed. The invention is adapted to direct-writing of micron-sized features ( ) on surfaces, for example, microcircuits and microcircuit components for “smart” credit cards and biological implants, to recording emission spectra of trapped particles and to many other such uses. Deposited material ( ) is treated by laser light ( ) by particle melting, decomposition, sintering or other chemical and mechanical reactions caused by laser interaction with the particle. Resulting, treated depositions have desirable mechanical and electrical properties for electronics and micro-electronic-mechanical system applications.


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