The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2003
Filed:
Jun. 26, 2002
Applicant:
Inventors:
Assignee:
The Furukawa Electric Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 3/300 ; H01S 3/19 ;
U.S. Cl.
CPC ...
H01L 3/300 ; H01S 3/19 ;
Abstract
A semiconductor device including a substrate, a mesa post overlying the substrate and having a substantially cylindrical shape, a resin member surrounding the mesa post and a stress moderating member received in the mesa post for moderating stress between the mesa post and the resin member. The stress applied to the mesa post is reduced because the entire volume of the resin member is divided by the stress moderating member and each of the divided resin members reduces the stress.