The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2003
Filed:
Jan. 11, 2002
Toyoki Asada, Yokohama, JP;
Yuji Fujita, Yokohama, JP;
Hideo Sotokawa, Yokohama, JP;
Kazumi Kawamoto, Yokohama, JP;
Kunio Matsumoto, Koshigaya, JP;
Shinya Hamagishi, Fujisawa, JP;
Mari Matsuyoshi, Yokohama, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
An electronic device, in which terminals of a semiconductor integrated circuit chip and terminals of a circuit substrate are mounted with solder so as to face one another. The electronic device includes a first resin, which is disposed between the circuit substrate and a terminal formation face of the semiconductor integrated circuit chip and a second resin, which is disposed at the outer perimeter of the semiconductor integrated circuit chip or is disposed laterally thereon. The modulus of elasticity of the second resin is smaller than the modulus of elasticity of the first resin, the modulus of elasticity of the second resin is at least 0.5 GPa but not more than 28 GPa at room temperature.