The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2003
Filed:
Apr. 04, 2001
NEC Tokin Corp., Miyogi, JP;
Abstract
In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) ( ) operates at a high speed in using at a high frequency band, and a predetermined number of terminals ( ) are provided with a high frequency current suppressor ( ) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor ( ) is a thin film magnetic substance having a range from 0.3 to 20 (&mgr;m) in thickness, and is disposed on the entire surface of each terminal ( ), covering a mounting portion to be mounted on a printed wiring circuit board ( ) for mounting IC ( ) and an edge including a connecting portion to a conductive pattern ( ) disposed on the printed wiring circuit board ( ). When the top end is connected with the conductive pattern ( ) by means of a solder ( ) in mounting the printed wiring circuit board ( ) of IC ( ), the vicinity of the mounting portion has conductivity in a using frequency band, which is less than a few tens MHz.