The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2003
Filed:
Jun. 05, 2001
Takuma Aoyama, Chiba-ken, JP;
Akihiko Okada, Chiba-ken, JP;
Idemitsu Petrochemical Co., Ltd., Tokyo, JP;
Abstract
There are disclosed a molding material which is used for molding a styrenic polymer and which is capable of affording moldings that are excellent in solvent resistance and mechanical strength even when produced at a molding temperature almost same as that of ordinary atactic polystyrene, namely at a resin temperature of 260° C. or lower, dispensing with a melt kneading step; a process for producing a molding by molding the above molding material, which process enables to shorten molding cycle time and curtail the producton cost; and the moldings produced thereby. The molding material comprises a dry blend of 10 to 95% by weight of a (A) styrenic polymer having atactic configuration and 2 to 90% by weight of a (B) styrenic polymer having a melting point of 250° C. or lower, a weight average molecular weight of at most 200,000 and mainly syndiotactic configuration.