The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6635563 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 21, 2003

Filed:

Sep. 20, 2001
Applicant:
Inventor:

Yoji Nakata, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/14763 ;
U.S. Cl.
CPC ...
H01L 2/14763 ;
Abstract

Precisely forming a fine resist pattern on a stopper film of silicon nitride, in a method of manufacturing a multi-layer interconnection structure which uses the stopper film. A silicon nitride film forming step is a step to select a thickness of a silicon nitride film to thereby reduce reflection light of an excimer laser which impinges upon a photoresist layer on the silicon nitride film from the back surface of the photoresist layer.


Find Patent Forward Citations

Nakata, Yoji. (2003). Method of manufacturing semiconductor device (U.S. Patent No. 6635563). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6635563

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