The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2003
Filed:
May. 22, 2002
Philip Paul Kraft, Warminster, PA (US);
Steven C. Deffler, Medford, NJ (US);
Lockheed Martin Corporation, Bethesda, MD (US);
Abstract
A method for making an HDI circuit including backside connections uses parylene as a protective coating. The method includes the steps of: procuring an insulating substrate including an active chip which has exposed electrical or thermal connection(s) on the rear surface thereof, applying a parylene coating to the exposed connections to protect the connections; performing additional HDI interconnect processing steps as desired on the front surface of the substrate; selectively removing a portion of the parylene coating to expose at least a portion of a connection; and making electrical connection to the exposed backside connections by application of a conductive material in its liquid state to the removed regions. The parylene coating is removed by an excimer laser. The step of making electrical connection to the backside electrical connections may be performed by application of solder, or conductive epoxy in its liquid state.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile