The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2003
Filed:
Dec. 14, 2000
Applicant:
Inventors:
Shuichi Ogata, Osaka, JP;
Kenichi Itoh, Osaka, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/3495 ;
Abstract
On a surface of a pair of support leads formed in one piece with a die pad on which a semiconductor chip is mounted, a protrusion is formed on the side that the semiconductor chip is mounted. During a resin-sealing, a lower surface of the die pad is brought into contact with an internal wall surface of a lower die, while a top of the protrusion is brought into contact with an internal wall surface of an upper die. This makes it possible to prevent the displacement of the die pad during sealing, thus causing no residual distortion of the semiconductor chip. As a result, a semiconductor device with a stable quality can be obtained.