The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2003

Filed:

Apr. 20, 2000
Applicant:
Inventors:

Robert S. Williamson, III, Madison, WI (US);

Robert A. Marsland, Madison, WI (US);

Assignee:

New Focus, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/36 ;
U.S. Cl.
CPC ...
G02B 6/36 ;
Abstract

The present invention provides a method and apparatus for packaging high frequency electrical and/or electro-optical components. The present invention provides a package which may be surface mounted on a board with other electrical components. The shielding provided by the package minimizes electromagnetic interference with other electrical components on the board. The package includes a controlled impedance I/O interface for coupling with the electrical and/or electro-optical component(s) in the package. The package interface may also include a differential I/O capability to further control electromagnetic fields generated at the interface. Additionally, the package may include an optical link provided by one or more optical fibers extending from the package.


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Williamson, III, Robert. (2003). Method & apparatus for packaging high frequency components (U.S. Patent No. 6632029). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6632029

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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