The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2003

Filed:

Aug. 01, 2001
Applicant:
Inventor:

Minoru Yamaguchi, Tokyo, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23P 1/900 ;
U.S. Cl.
CPC ...
B23P 1/900 ;
Abstract

An electronic component mounting apparatus uses sensors and a controller to correct the position at which a component holder, generally a suction nozzle, captures a component, thus avoiding component capture errors and failures. More specifically, sensors detect a deviation amount between a predetermined location on a component absorbed by a suction nozzle and the suction position of the suction nozzle. The deviation amount is multiplied by a sensitivity coefficient, and the resulting adjusted deviation amount is then applied by the controller to correct the position of the suction nozzle when capturing a subsequent component. Accordingly, the subsequent component is absorbed by the suction nozzle normal to the component and at a position substantially centered with respect to the component, reducing the occurrence of suction errors.


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