Method of forming integral passive electrical components on organic circuit board substrates

Abstract

A process for forming stable integrated resistors ( ) and capacitors ( ) on organic substrates ( ). The resistors ( ) and capacitors ( ) are capable of a wide range of resistance and capacitance values, yet can be processed in a manner that does not detrimentally effect the organic substrate ( ) or entail complicated processing. The method generally entails the use of thick-film materials usually of the types used to form resistors and capacitors on ceramic substrates. The thick-film materials are applied to an electrically-conductive foil ( ) and then heated to bond the thick-film material to the foil ( ) and form a solid resistive or capacitive mass ( ). The foil ( ) is then laminated to an organic substrate ( ), such that the resistive/capacitive mass ( ) is attached to and preferably embedded in the organic substrate ( ). Finally, the foil ( ) is etched to form at least one of two terminals that contact the resistive/capacitive mass ( ) and thereby complete the passive electrical component ( ). Resistors ( ) can also be formed of polymer thick-film (PTF) inks, in which case the PTF ink is cured on the foil ( ) for an extended period at a temperature sufficient to completely cure the ink prior to laminating the foil ( ) to the organic substrate ( ).