The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2003

Filed:

Feb. 07, 2002
Applicant:
Inventors:

Nurwati S Devnani, Fort Collins, CO (US);

William S Burton, Fort Collins, CO (US);

Sari K Christensen, Ft. Collins, CO (US);

Assignee:

Agilent Technologies, Inc., Palo Alto, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 ; H05K 1/00 ;
U.S. Cl.
CPC ...
H05K 1/03 ; H05K 1/00 ;
Abstract

A high-performance, integrated circuit interconnection laminate. Power/ground layers in laminates fabricated with open areas to permit out gassing of gases generated during high temperature lamination are located such that they do not lie under/over critical traces on signal layers. This placement of the open areas enables a reduction in cross-talk between signal layers lying on opposite sides of a power/ground layer and a reduction in signal delay.


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