The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2003
Filed:
May. 01, 2001
Applicant:
Inventors:
Edward C. Skorupski, Stillwater, NY (US);
Jeffrey T. Gray, Cambridge, NY (US);
John A. Andresakis, Clifton Park, NY (US);
Wendy Herrick, Clifton Park, NY (US);
Assignee:
Oak-Mitsui, Inc., Hoosick Falls, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
D02J 1/22 ;
U.S. Cl.
CPC ...
D02J 1/22 ;
Abstract
The invention relates to the manufacture of printed circuit boards having improved interlayer adhesion. More particularly, the present invention pertains to adhesiveless printed circuit boards having excellent thermal performance and useful for producing high-density circuits. A metal foil is laminated to an etched surface of a polyimide substrate having a polyimide film thereon. Etching the substrate surface allows for strong adhesion of a pure polyimide film to the substrate.