The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2003
Filed:
May. 31, 2001
Matthijs D. Pardoen, Sunnyvale, CA (US);
Wayne T. Holcombe, Mountain View, CA (US);
Integration Associates Inc., Mountain View, CA (US);
Abstract
A circuit and method are shown for battery reversal protection. The circuit includes a first transistor that buffers a bulk terminal of a protected transistor from an input terminal for receiving a power supply voltage. A second transistor is coupled to both the input terminal of the circuit and an output terminal of the circuit and detects when the power supply voltage falls below an output voltage at the output terminal and, responsive thereto, switches off the first transistor to isolate the bulk terminal of the protected transistor from the input terminal. Another aspect of the invention provides current reversal protection using a third transistor that also detects when the power supply voltage falls below an output voltage at the output terminal and, responsive thereto, conducts current from the output terminal to the gate terminal of the protected transistor. In yet another aspect of the invention, a bulk of the third transistor is coupled to a low current circuit to provide current to the low current circuit from the output terminal when power at the input terminal is interrupted. Because of low current demands on the transistors of the protection circuit, small area transistors may be used to implement the protection circuit using reduced die area.