The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2003
Filed:
Aug. 29, 2001
Applicant:
Inventor:
Fumio Uchikoba, Tokyo, JP;
Assignee:
TDK Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/10 ; H03H 9/64 ; H03H 9/05 ; H05K 5/06 ; H05K 7/06 ;
U.S. Cl.
CPC ...
H03H 9/10 ; H03H 9/64 ; H03H 9/05 ; H05K 5/06 ; H05K 7/06 ;
Abstract
The surface acoustic wave elements and the other surface mounting elements are mounted on a ceramic multi-layer substrate. The surface acoustic wave elements may be flip chips face-down-bonded to the gold coated mounting electrodes of the multi-layer ceramic substrate by gold-to-gold bonding. At least the surface acoustic wave elements are covered as sealed airtight with the side walls fixed to the multi-layer ceramic substrate and a cover closing the opening of the side walls.
Uchikoba, Fumio. (2003). Radio frequency module parts including surface acoustic wave elements and manufacturing method thereof (U.S. Patent No. 6628178). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6628178
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile