The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2003
Filed:
May. 17, 2002
Applicant:
Inventors:
Sailesh Chittipeddi, Allentown, PA (US);
Keelathur N. Vasudevan, Macungie, PA (US);
Assignee:
Agere Systems Inc., Allentown, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/3544 ;
U.S. Cl.
CPC ...
H01L 2/3544 ;
Abstract
The present invention provides a die located on a semiconductor wafer. In one embodiment, the die includes a circuit region located within a circuit perimeter of the die. In addition, the die includes a bond pad region located between the circuit perimeter and an outer perimeter of the die. Also the die includes an alignment mark located within the bond pad region.
Chittipeddi, Sailesh. (2003). Integrated circuit die having alignment marks in the bond pad region and method of manufacturing same (U.S. Patent No. 6628001). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6628001
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile