Semiconductor device having fluorine containing silicon oxide layer as dielectric for wiring pattern having anti-reflective layer and insulating layer thereon

Abstract

A semiconductor device with satisfactory bonding ability of a plasma SiOF oxide layer on a wiring and satisfactory burying ability for burying wiring space portions. The semiconductor substrate, forming an anti-reflection layer of a refractory metal or compound thereof, on the metal layer, and forming an insulation layer on the anti-reflection layer. There after, the insulation layer is patterned and a wiring is formed by etching the anti-reflection layer and the metal layer while taking the patterned insulation layer as a mask and leaving the anti-reflection layer and the insulation layer on the wiring. Subsequently, the patterned wiring is buried with an SiOF layer as an Si oxide layer containing fluorine, together with the anti-reflection layer and the insulation layer on the upper surface thereby.