The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2003

Filed:

Dec. 21, 2000
Applicant:
Inventors:

Anthony G. Karandinos, St. Stevens-Woluwe, BE;

David J. Lohse, Bridgewater, NJ (US);

Keith A. Nelson, Seabrook, TX (US);

Jean M. Tancrede, Baton Rouge, LA (US);

Bruce Allan Harrington, Houston, TX (US);

Olivier J. F. Georjon, Brussels, BE;

Kenneth Lewtas, Tervuren, BE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F / ; C08F 4/64 ;
U.S. Cl.
CPC ...
C08F / ; C08F 4/64 ;
Abstract

The invention relates to novel adhesive alpha-olefin inter-polymers which are largely amorphous and have a rheological behavior that makes them suitable for adhesive use, both without and with minimized amounts of tackifying resins. Specifically, the invention poly-alpha olefin inter-polymer may be composed of A) from 60 to 94 mol % of units derived from one alpha mono-olefin having from 3 to 6 carbon atoms and B) from 6 to 40 mol % of units derived from one or more other mono-olefins having from 4 to 10 carbon atoms and at least one carbon atom more than A); and C) optionally from 0 to 10 mol % of units derived from another copolymerizable unsaturated hydrocarbon, different from A) and B); the diad distribution of component A in the polymer as determined by C NMR as described herein showing a ratio of experimentally determined diad distribution over the calculated Bernoullian diad distribution of less than 1.07; and the storage modulus G′ of said polymer, determined upon cooling as described herein, intersecting a value of 3.10 Pa at a temperature of less than 85° C. The invention also describes polymerization processes suitable for the manufacture of these adhesive alpha-olefin inter-polymers.


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