The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2003

Filed:

Nov. 17, 2000
Applicant:
Inventors:

Hakaru Matsui, Ibaraki, JP;

Takaaki Ichikawa, Ibaraki, JP;

Seigi Aoyama, Ibaraki, JP;

Koichi Tamura, Ibaraki, JP;

Osamu Seya, Ibaraki, JP;

Hiroshi Komuro, Ibaraki, JP;

Ryohei Okada, Ibaraki, JP;

Shigetoshi Goto, Ibaraki, JP;

Assignee:

Hitachi Cable Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/02 ;
U.S. Cl.
CPC ...
C22C 9/02 ;
Abstract

In an extrafine or ultrafine copper alloy wire having an outer diameter of not more than 0.1 mm, the copper alloy wire is formed of a heat treated copper alloy comprising 0.05 to 0.9% by weight in total of at least one metallic element selected from the group consisting of tin, indium, silver, antimony, magnesium, aluminum, and boron and not more than 50 ppm of oxygen with the balance consisting of copper. By virtue of this constitution, the extrafine or ultrafine copper alloy wire has a combination of excellent bending fatigue lifetime based on high tensile strength and excellent torsional strength based on high elongation or a combination of excellent tensile strength, electrical conductivity, and drawability and good elongation. The invention has been described in detail with particular reference to preferred embodiments, but it will be understood that variations and modifications can be effected within the scope of the invention as set forth in the appended claims.


Find Patent Forward Citations

Loading…