The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2003
Filed:
Apr. 11, 2002
Ernest J. Morrow, Monticello, FL (US);
Sally M. Sellers, Tallahassee, FL (US);
Gary D. Knudsen, Tallahasse, FL (US);
General Dynamics Land Systems, Inc., Sterling Heights, MI (US);
Abstract
A modular spray cooling system for cooling electronic components in enclosures containing electronic components that dissipate heat and therefore require cooling. The modular system is mounted in a sealed enclosure with an inside wall . A spray cooling module is detachably mountable within the sealed enclosure . The coolant is distributed to a spray manifold card that is provided with nozzles. Localized cooling is accomplished with the use of individual nozzles . The spray cooling module atomizes the evaporative coolant through nozzles so that liquid droplets of the coolant are delivered to the electronic components, and cooling of the components occurs upon evaporation. A method for cooling electronic components comprises the steps of: providing a sealed enclosure ; priming the sealed enclosure with an evaporative coolant that recirculates therewithin; detachably placing within the enclosure one or more sealed circuit card assemblies containing the electronic components to be cooled; a spray cooling module within the enclosure and delivering power to a pump within a spray cooling module that is also detachably mountable within the sealed enclosure