The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2003
Filed:
Jan. 03, 2001
Applicant:
Inventor:
Philip Joseph Koh, Centerville, VA (US);
Assignee:
Sophia Wireless, Inc., Chantilly, VA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/352 ; H01L 2/302 ;
U.S. Cl.
CPC ...
H01L 2/352 ; H01L 2/302 ;
Abstract
A direct attachment technique is described for silicon packages housing high frequency devices. A silicon package may be shaped as either a plug or a socket or the package may have both the plug and socket capability, thus enabling the package to be directly attached to other packages The plug is trapezoidal in cross section while the socket has a dovetail-joint-like aperture. The plug is inserted into the socket thereby directly attaching one package to another. The two packages are locked together when the slanted edges of the plug are fitted to the slanted edges of the socket.