The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2003
Filed:
Jan. 10, 2001
Michiaki Iha, Kusatsu, JP;
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Abstract
A photosensitive glass paste containing: an inorganic component containing a glass powder and a photosensitive organic component is provided. The glass powder contains about 1 to 30 percent by weight of a low melting point glass powder having a glass softening point in a range of about 400° C. to 600° C. and about 70 to 99 percent by weight of a high melting point glass powder having a glass softening point about 300° C. or more higher than the glass softening point of the low melting point glass. As the high melting point glass, a borosilicate glass which inhibits diffusion of a conductive component such as Ag is employed. The content of the inorganic component in the photosensitive glass paste is in a range of about 40 to 70 percent by weight. A method of manufacturing a multilayered interconnected circuit board using the above-described photosensitive glass paste is also provided.