The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2003

Filed:

Jun. 24, 1999
Applicant:
Inventors:

Takashi Monzen, Yamanashi, JP;

Takahito Hirashima, Yamanashi, JP;

Assignee:

KITZ Corporation, Chiba, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 6/310 ; B01D 6/302 ;
U.S. Cl.
CPC ...
B01D 6/310 ; B01D 6/302 ;
Abstract

This invention relates to a hollow fiber membrane module to be used in industrial fields such as the semiconductor industry, food processing industry, pharmaceutical industry, and medical industry, and to a method for the production thereof. Permselective hollow fiber membranes having rigidity are cheese-wound in a plurality of layers, thereby forming a hollow fiber membrane bundle. One terminal part of this hollow fiber membrane bundle together with a case is adhered and solidified with a thermally molten mass of thermoplastic resin, thereby forming a solidified part. This solidified part is cut to form a sealed part serving to open terminal parts of the hollow fiber membranes.


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Monzen, Takashi. (2003). Hollow-fiber membrane module (U.S. Patent No. 6623637). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6623637

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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