The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2003

Filed:

Jun. 28, 2002
Applicant:
Inventors:

Michinori Watanabe, Tokyo, JP;

Toshiki Ogawara, Tokyo, JP;

Haruhisa Maruyama, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 ;
U.S. Cl.
CPC ...
H05K 7/20 ;
Abstract

An electronic component cooling apparatus is provided that can prevent a reduction in a heat dissipation effect on an electronic component with a pushing force toward a heat sink thereof being applied to the opposite wall of a casing thereof. Pushing force transferring sections for transferring a pushing force from mounting tools to a heat sink through contact with leading ends of radiation fins are integrally formed on a pair of wall sections of a casing The pushing force transfer sections have a shape that can distribute the pushing force and transfer distributed force to the heat sink so as to prevent a force applied to an electronic component MPU by the pushing force from being locally and extremely increased.


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