The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2003

Filed:

Dec. 28, 2000
Applicant:
Inventors:

Martin R. Handforth, Kanata, CA;

Herman Kwong, Kanata, CA;

Richard R. Goulette, Arnprior, CA;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/08 ;
U.S. Cl.
CPC ...
H01P 3/08 ;
Abstract

A technique for providing a multi-layer substrate which is capable of signal transmission at multiple propagation speeds is disclosed. In one embodiment, the technique is realized by constructing a multi-layer substrate by creating air channels in dielectric layers adjacent to a conductor. The air channels may also be filled with an alternative dielectric material. At least three types of multi-layer substrates may be produced through this technique. Furthermore, signal tracks of varying lengths can be provided to accommodate differing delays.


Find Patent Forward Citations

Handforth, Martin. (2003). Technology implementation of suspended stripline within multi-layer substrate used to vary time delay and to maximize the reach of signals with high data rates or high frequencies (U.S. Patent No. 6621384). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6621384

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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