Electronic device having an electronic component with a multi-layer cover, and method

Abstract

An electronic device includes an electronic component such as a SAW (=Surface Acoustic Wave) filter having connection areas The filter is sealed off from the environment by means of a cover forming a cavity above the filter According to the invention, the cover is formed by a lacquer layer A which is provided, at the location of the filter with an opening and which is covered with a photoresist layer B closing the opening such that the cavity thus formed has a thickness above zero everywhere above the filter This enables an accurate and stable frequency selection by means of the filter and allows the device according to the invention to be very compact and easy to manufacture. Thus, the device according to the invention is very suitable for use in an application such as a mobile telephone, also after integration of the device with a semiconductor device. The photoresist layer B and the lacquer layer A preferably contain further openings , at the location of the connection regions which are provided with bumps preferably solder bumps Preferably, the photoresist layer B includes a solid foil B, which is solder-repellent.