The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2003
Filed:
Feb. 08, 2002
Masaaki Kanae, Otsu, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A semiconductor chip production method in which, when a semiconductor chip is formed by severing from a semiconductor wafer, a short side of a semiconductor device is arranged and disposed along a direction which is parallel to a crystal orientation direction, and a severing area along the short side of the semiconductor device is formed so that its width is smaller than the width of a severing area along a long side of the semiconductor device. Further, the widths of the severing areas along the long and short sides of the semiconductor devices are formed so that after severing, the ratio between the long sides and the short sides of the semiconductor chips is smaller than the ratio between the long sides and the short sides of the unseparated semiconductor devices. The invention aims at preventing a reduction in the mechanical strength of a rectangular semiconductor chip having vertical and horizontal dimensions that are different from each other, when producing the rectangular semiconductor chip.