The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2003
Filed:
Jan. 15, 2002
Cheng-Chi Wang, Yungkang, TW;
Abstract
A hillock-free wiring layer and method of forming the same are provided. The wiring layer includes at least two aluminum (Al) layers formed on a substrate, and each of the Al layers includes Al crystal particles. For any two Al layers of the wring layer, the one closer to the substrate is called the lower layer and the other one is called the higher layer. Besides, the Al crystal particles of the higher Al layer are larger and denser than that of the lower Al layer, and the lower Al layer has a higher resistance than that of the higher Al layer. By the invention, a wiring layer using either pure Al or an Al-based alloy is capable of preventing the occurrence of hillocks and reducing manufacturing cost.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile