The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2003

Filed:

Feb. 09, 2000
Applicant:
Inventor:

William T. Mead, Irvine, CA (US);

Assignee:

Northrop Grumman Corporation, Los Angeles, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 7/044 ;
U.S. Cl.
CPC ...
B29C 7/044 ;
Abstract

A method of forming a resin composite part utilizing a mold surface for mitigating post-cure machining of the resin composite part. The method provides for forming a resin preform having a peripheral geometry similarly sized and configured as a configuration of the mold surface. The mold surface is sized and configured to receive the resin preform. The resin preform is then cured to form the resin composite part with the resin composite part being confirmed to the configuration of the mold surface for mitigating post-cure machining of the resin composite part.


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