Ultrasonic processing device and electronic parts fabrication method using the same

Abstract

To provide an ultrasonic processing device that is capable of effectively carrying out a cleaning operation, a resist-stripping operation, etc. by projecting ultrasonic uniformly over an entirety of the ultrasonic processing target region by means of ultrasonic oscillation elements each having a width smaller than an ultrasonic processing target region of a processing object, as well as to provide an electronic parts fabrication method using the foregoing device, a plurality of ultrasonic oscillation elements are arranged so as to planarly extend in a glass substrate transport direction and in a glass substrate width direction, and projected figures obtained by projecting said ultrasonic oscillation elements to a plane perpendicular to the glass substrate transport direction form a single belt-like region of a width exceeding a width of the ultrasonic processing target region. The foregoing arrangement causes ultrasonic-projected regions of the ultrasonic oscillation elements to partly overlap each other on a surface of the glass substrate when the glass substrate is transported by transport rollers in the transport direction, thereby enabling ultrasonic projection over the complete entirety of the ultrasonic processing target region.