The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2003

Filed:

Jul. 27, 2001
Applicant:
Inventor:

Siamak Fazelpour, San Diego, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 1/20 ; H01P 3/08 ;
U.S. Cl.
CPC ...
H01P 1/20 ; H01P 3/08 ;
Abstract

An electronic device package includes a multilayer substrate having an interconnect structure configured to propagate a high frequency signal from one metal layer to another metal layer. The configuration and layout of the interconnect structure, particularly the arrangement of the reference vias associated with the signal via, is selected such that a desired filter response is achieved. The filter response is realized without any additional capacitor or inductor components. Thus, the natural discontinuity created by the vias and the inherent parasitic capacitance and inductance associated with the vias can be utilized to create a desired lowpass or bandpass filter response.


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