The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2003

Filed:

Jan. 25, 2001
Applicant:
Inventors:

Louis L. Hsu, Fishkill, NY (US);

Rajiv V. Joshi, Yorktown Heights, NY (US);

Carl Radens, Langrangeville, NY (US);

Jack A. Mandelman, Stormville, NY (US);

Tsorng-Dih Yuan, Hopewell Junction, NY (US);

Assignee:

IBM Corporation, Armonk, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/3544 ;
U.S. Cl.
CPC ...
H01L 2/3544 ;
Abstract

The present invention provides for globally aligning microelectronic circuit systems, such as communication devices and chips, fabricated on or bonded to the front and back sides of one or more substrates to provide for wireless communications between the circuit systems through the one or more substrates. In one embodiment, two circuit systems situated on opposite sides of a substrate are aligned to provide for wireless communications between the two circuit systems through the substrate. In another embodiment, communication devices situated on one or more substrates are aligned to provide for wireless communications between the communication devices through the one or more substrates. In another embodiment, two chips situated on opposite sides of a transparent substrate are aligned to provide for wireless communications between the two chips through the transparent substrate.


Find Patent Forward Citations

Hsu, Louis. (2003). Semiconductor device utilizing alignment marks for globally aligning the front and back sides of a semiconductor substrate (U.S. Patent No. 6617702). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6617702

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…