The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2003
Filed:
Feb. 20, 2001
Applicant:
Inventors:
Gregory Scott Becker, Sanford, MI (US);
Geoffrey Bruce Gardner, Sanford, MI (US);
Brian Robert Harkness, Midland, MI (US);
Louise Ann Malenfant, Midland, MI (US);
Satyendra Kumar Sarmah, Midland, MI (US);
Assignee:
Dow Corning Corporation, Midland, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/302 ; H01L 2/348 ; H01L 2/148 ; H01L 2/144 ; H01L 2/130 ;
U.S. Cl.
CPC ...
H01L 2/302 ; H01L 2/348 ; H01L 2/148 ; H01L 2/144 ; H01L 2/130 ;
Abstract
A semiconductor package comprising a wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone layer covering the surface of the wafer, provided at least a portion of each bond pad is not covered with the silicone layer and wherein the silicone layer is prepare by the method of the invention.