The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2003
Filed:
Oct. 03, 2001
Victor Company of Japan, Limited, Kanagawa-Ken, JP;
Abstract
A printed circuit board includes an insulative substrate. A first conductive layer having a predetermined width and length is formed on the insulative substrate, the first conductive layer extending in a first direction. A first insulative layer is formed over the first conductive layer. A circuit pattern having a narrower width than that of the first conductive layer is provided in parallel with the first direction of the first conductive layer, the circuit pattern being formed on the first insulative layer. A second insulative layer is formed over the circuit pattern. A pair of grooves is formed alongside the entire length of both sides of the circuit pattern and in the first and second insulative layers so as to expose the first conductive layer, the pair of grooves extending in a second direction parallel to the first direction so as to sandwich the circuit pattern there between. A second conductive layer is formed on the second insulative layer continuously from an inner wall of one of the pair of grooves to an inner wall of another groove of the pair of grooves so as to connect to the first conductive layer. The second conductive layer is connected to the first conductive layer through the first and second insulative layers forming a structure that surrounds the circuit pattern.