The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2003
Filed:
Jul. 05, 2001
Minoru Nozawa, Yokohama, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
In the electrode pads in the ink jet print head substrate that uses ball bumps, bonding of the ball bumps is carried out in satisfactory condition despite reduced thickness of films in the substrate. In an ink jet print head substrate, which has a heater film constituting the heater portions, a second electric wire in electrical contact with the heater film to supply it with electric power, and a first electric wire constituting a common electrode of a matrix wire for selectively driving the heater portions, the first electric wire is used as the electrode pads to which the ball bump is joined. The first electric wire does not need to be reduced in thickness even when the thickness of the protective film is reduced. Thus, an ultrasonic wave can be transferred well to the electrode pad during ultrasonic bonding.